TSMC's 3nm Process Powers MediaTek's Next-Gen Flagship Chipset

In a major breakthrough for the semiconductor industry, MediaTek, a leading fabless semiconductor company, has announced the successful development of its first chip utilizing Taiwan Semiconductor Manufacturing Company's (TSMC) cutting-edge 3nm process. This significant achievement sets the stage for the volume production of MediaTek's next-generation flagship chipset in 2024.

The collaboration between MediaTek and TSMC marks a significant milestone in their longstanding strategic partnership. By leveraging TSMC's advanced manufacturing capabilities and MediaTek's expertise in chip design, the companies have jointly created a high-performance system-on-chip (SoC) known as Dimensity.

• Related: The latest Dimensity processor before 2025.

The adoption of TSMC's 3nm process technology brings several advantages to MediaTek's flagship chipset. This technology enables the creation of smaller, more power-efficient transistors, resulting in enhanced performance and reduced power consumption. As a result, end devices powered by MediaTek's Dimensity SoC are expected to offer unparalleled performance and improved user experiences.

Joe Chen, President of MediaTek, expressed the company's dedication to utilizing cutting-edge technologies to develop products that have a meaningful impact on people's lives. He emphasized TSMC's consistent and high-quality manufacturing capabilities as a crucial factor in MediaTek's ability to showcase their superior chip design in flagship devices. Chen believes that this collaboration will enable MediaTek to provide its global customers with top-of-the-line solutions, further strengthening its presence in the flagship market.

• Read also: The latest Helio processor by far.

Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, highlighted the significance of the collaboration, stating that the power of TSMC's advanced semiconductor process technology will now be accessible through MediaTek's Dimensity SoC. With the 3nm process, the industry's most advanced technology will be integrated into smartphones and other devices, offering users exceptional performance and efficiency.

The successful development of MediaTek's Dimensity SoC using TSMC's 3nm process represents a remarkable achievement in the semiconductor landscape. As the demand for high-performance and power-efficient chipsets continues to grow, this collaboration sets the stage for MediaTek to deliver innovative solutions that can meet the evolving needs of consumers worldwide.

With volume production scheduled for 2024, MediaTek's upcoming flagship chipset is poised to make a significant impact on the mobile and consumer electronics markets, driving advancements in performance, power efficiency, and user experience.

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